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Electroplating Chemicals KM CU 80
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Specification of Electroplating Chemicals KM CU 80

KM CU 80

KM CU 80 bight cyanide copper plating process produces smooth and bright deposits. The deposits are exceptionally bright and give good corrosion protection. The process provides good metal distribution and permits to operate at higher current density.
The KM CU 80 deposit does not require activation in the processing cycle between copper and subsequent nickel plating operations. The following benefits can be obtained from the use of the KM CU 80 process.
 A fully bright deposit over a wide current density range.
 Higher current densities.
 Good tolerance to impurities.
 Good anode corrosion.
 Easy to control.
 No activation required prior to nickel plating.

Electroplating Chemicals

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